Institute of Electrical and Electronics Engineers (IEEE)
Journal of Microelectromechanical Systems
,  том 33 ,  издание 1 ,  страницы 6-8

JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial

Тип публикации: Journal Article
Дата публикации: 2024-02-01
Institute of Electrical and Electronics Engineers (IEEE)
scimago Q2
wos Q2
БС1
SJR: 0.592
CiteScore: 6.2
Impact factor: 3.1
ISSN: 10577157, 19410158
Electrical and Electronic Engineering
Mechanical Engineering
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Luo C., Hopkins J. W., Cullinan M. A. JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial // Journal of Microelectromechanical Systems. 2024. Vol. 33. No. 1. pp. 6-8.
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Luo C., Hopkins J. W., Cullinan M. A. JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial // Journal of Microelectromechanical Systems. 2024. Vol. 33. No. 1. pp. 6-8.
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TY - JOUR
DO - 10.1109/jmems.2023.3332595
UR - https://ieeexplore.ieee.org/document/10325651/
TI - JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial
T2 - Journal of Microelectromechanical Systems
AU - Luo, Chenyang
AU - Hopkins, Jonathan W.
AU - Cullinan, Michael A.
PY - 2024
DA - 2024/02/01
PB - Institute of Electrical and Electronics Engineers (IEEE)
SP - 6-8
IS - 1
VL - 33
SN - 1057-7157
SN - 1941-0158
ER -
BibTex |
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@article{2024_Luo,
author = {Chenyang Luo and Jonathan W. Hopkins and Michael A. Cullinan},
title = {JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial},
journal = {Journal of Microelectromechanical Systems},
year = {2024},
volume = {33},
publisher = {Institute of Electrical and Electronics Engineers (IEEE)},
month = {feb},
url = {https://ieeexplore.ieee.org/document/10325651/},
number = {1},
pages = {6--8},
doi = {10.1109/jmems.2023.3332595}
}
MLA
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Luo, Chenyang, et al. “JMEMS Letters.1pt Response Speed Characterization of a Thermally Actuated Programmable Metamaterial.” Journal of Microelectromechanical Systems, vol. 33, no. 1, Feb. 2024, pp. 6-8. https://ieeexplore.ieee.org/document/10325651/.